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This machine is designed for conductive/non-conductive resin hole plugging processes, ensuring full filling without depressions or bubbles. It is suitable for selective through-holes, blind vias, back-drilled holes, and other plugging applications. Compatible with silver resin, copper resin, conductive adhesives, as well as domestic and imported resin.
Features
Selective via hole filling of through holes and blind vias.
Complete solutions for the air bubble and cavity defects in High AR panels.
The operating interface is automated, user-friendly and easy to operate.
Production Capacity (excluding loading and unloading time)
40-100 boards per hour (depending on PCB size, thickness, aspect ratio, resin viscosity and other factors)
Product Specifications
Production thickness:0.2-8.0 mm | Printable area:MAX:24 寸 *36 寸 (610*910mm） | ||
Plugging speed:2-660mm/s（Digitally Adjustable Settings） | Plugging pressure:1-250kgf（Digitally Adjustable Settings） | ||
Squeegee Adjustment Angle:±15° Table flatness:±0.05mm | Scraper adjustment distance: 0-40mm（Digitally Adjustable Settings） | ||
Table Micro-Adjustment Stroke:±5mm | Table Fine-Adjustment Precision： X andY directions: ±5μm | ||
Table flatness:±0.05mm | Table Repeating Positioning Accuracy:±0.005mm | ||
Thickness of frame:25-45mm | Stencil fixing method: 10-Point Air Pressure Lock | ||
Squeegeeing Stroke: 0-1000mm（Digitally Adjustable Settings） | Scratch Printing Method: Single Squeegee Overprinting | ||
Clearance:0-30mm（Digitally Adjustable Settings） | Mesh frame dimensions: Min:900*900mm MAX：1300*1300mm | ||
Transformation number, material number time: ≤ 15min（Skilled Worker） | Countertop Dimensions:1100mm*1100mm | ||
Plugging material: Resin, Copper paste, Silver paste | Main unit: 6,000 kg Vacuum pump assembly: 500 kg | ||
Machine Dimensions（L×W×H） | L3770mm*W2040mm*H2381mm ( Main Unit Dimensions ) L3770mm*W3649mm*H2381mm（main unit and vacuum pump） | Main unit dimensions： L3770mm*W2040mm*H2381mm Including main unit + vacuum pump assembly: L3770mm*W3649mm*H2381mm | |
Filled hole diameter range (through-hole, blind via, back drill) | Through-hole: 0.1-1.0mm (pre-plating hole diameter) Blind via: 0.1-0.5mm (pre-plating hole diameter) Back-drilled hole: 0.15-1.0mm (pre-plating hole diameter) | ||
Plugging hole aspect ratio | Through-hole: Aspect ratio 40:1 | Blind via: Aspect ratio 4:1(Allows for multi-tool or two-sided plugging operations. | ||
Design Variation in In-Panel Plugging Hole Aperture | ≦ 0.25mm ( Simultaneous Processing Capability for Multiple Hole Sizes） | ||
Edge-to-hole spacing (for filled vs. unfilled vias): ≥ 0.3mm | Noise (normal operation): ≤ 75dB | ||
Operating Vacuum Level:30-100pa | Ultimate Vacuum:20pa | ||
Plugging effects: Bubble-free | Alignment method: Manual (precision: 0.01mm) | ||
Operator Interface:HMI | Safety protection: Emergency stop switch, Warning lights (red, yellow, green), Buzzer, Safety light curtain | ||
Automatic Alarms: Flashing lights and buzzer alarm | Printing with screen lift function:0-30mm | ||
Automatic screen mesh cleaning: The cleaning frequency can be set according to production requirements. | Auto resin feeding system: Resin can be added according to production requirements. | ||
