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This machine is designed for conductive/non-conductive resin hole plugging processes, ensuring full filling without depressions or bubbles. It is suitable for selective through-holes, blind vias, back-drilled holes, and other plugging applications. Compatible with silver resin, copper resin, conductive adhesives, as well as domestic and imported resin.
Features
Selective via hole filling of through holes and blind vias
Complete solutions for the air bubble and cavity defects in High AR panels
The operating interface is automated, user-friendly and easy to operate
Product Specifications
Model | VAPM6171 | VAPM6191 | |
Production thickness | 0.2-8.0 mm | 0.2-8.0 mm | |
Printable area | 24” *28 ” (610*710mm） | MAX:24” *36 ” (610*910mm） | |
Registration Method | CCD alignment | ||
Plugging speed:2-350mm/s（Digitally Adjustable Settings） | Plugging pressure:1-200kgf（Digitally Adjustable Settings） | ||
Squeegee Adjustment Angle:±15° Table flatness:±0.05mm | Scraper adjustment distance: 0-40mm（Digitally Adjustable Settings） | ||
Table Fine-Adjustment Precision： X and Y directions: ±5mm | Screen lifting:0-350mm（Screen Up/Down: 0-350mm (Digitally Controlled) | ||
Thickness of frame:25-45mm | Stencil fixing method: 10-Point Air Pressure Lock | ||
Squeegeeing Stroke | 0-780mm（Adjustable） | 0-1000mm（Adjustable） | |
Scratch Printing Method | Single Squeegee Overprinting | ||
Clearance | 0-30mm（Digitally Adjustable Settings） | ||
Mesh frame dimensions | Min：900*900MAX：1100*1100mm | MAX：1300*1300mm | |
Transformation number, material number time | ≤ 15min（Skilled Worker） | ||
Countertop Dimensions | 900*900mm | 1100mm*1100mm | |
Plugging Hole Types | Horizontal selection or full-board via filling | ||
Machine Dimensions（L×W×H） | Host dimensions (sliding cover rail, excluding tricolor light) L3440mm×W1800mm×H2447mm Including host + vacuum pump unit:L3440mm*W3200mm*H2447mm | L3620mm × W2400mm × H2200mm Including main unit + vacuum pump assembly: L3620mm × W3600mm × H2200mm | |
Weight | Main unit: 4,500 kg Vacuum pump assembly: 500 kg | Main unit: 5,000 kg Vacuum pump assembly: 500 kg | |
Scope of use | Through-hole/Blind via/Back-drilled hole filling | ||
Filled hole diameter range (through-hole, blind via, back drill) | Through-hole: 0.1-1.0mm (pre-plating hole diameter) Blind via: 0.1-0.5mm (pre-plating hole diameter) Back-drilled hole: 0.15-1.0mm (pre-plating hole diameter) | ||
Plugging hole aspect ratio | Through-hole: Aspect ratio 30:1 （Multiple passes or opposing plug methods are allowed）Blind via: Aspect ratio 3:1 (Finished hole diameter after plating: 0.05mm) | ||
Difference in aperture size between plates of the same type | ≦ 0.2mm（Simultaneous operation of large and small holes） | ||
Edge-to-hole spacing (for filled vs. unfilled vias) | ≥ 0.3mm (Aspect ratio: 10:1) | ||
Noise (normal operation): ≤ 75dB | Operator Interface::HMI | ||
Operating Vacuum Level:40-120pa | Ultimate Vacuum:10pa | ||
Plugging effects: Bubble-free | Alignment method: Automatic (precision: 0.01mm) | ||
Safety protection：Emergency stop switch, Warning lights (red, yellow,green), Buzzer, Safety light curtain | Plugging material: resin, copper paste, silver pasteresin, copper paste, silver paste | ||
Resin Waste Costs | Except for the paste adhered to the stencil and incompletely scraped paste, all other paste can be used for via filling | ||
Automatic Alarms: Flashing lights and buzzer alarm | Printing with screen lift function:0-30mm | ||
Automatic screen mesh cleaning | The cleaning frequency can be set according to production requirements. | ||
Auto resin feeding system | Resin can be added according to production requirements. | ||
