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Automatic Vertical High Vacuum Plugging Machine for IC-Substrate

Achieve Automatic Tape Peeling

Introductions

Non-contact Core layer via filling

Partical-Free Industrial Design

Dual- Mode  Workstation  with  Manual/Automatic Switching

R&D for FC-BGA and High Aspect Ratio ATE

Designed for carrier plate factories, it adopts automated linkage and contactless production technology to ensure quality stability and equipment  reliability during the production process

Industry-first  automated  hole  plugging  equipment improves productivity and work efficiency

By  optimising  processes,  energy  and  raw  material consumption is saved and sustainable development is achieved

Ensures  consistent  product  quality  and  intelligent production

Product Specifications

Machine Size

9420*2850*2595mm

Vacuum

≤ 100pa(Atmospheric pressure)

Panel thickness

0.2-10mm

Panel Size

MIN:510*510mm  MAX:510*635mm

Aspect Ratio

Through hole: 40:1 (Max.) Blind hole: 1:1 (Max., hole size after plating)

Diameter of plugging holes

Through hole: 0.1-1.0mm (hole diameter after plating)

Blind hole: 0.1-1.0mm (hole diameter after plating)

Plugging method

Full plate plug holes (top to bottom)

Plugging speed

2-80mm/sec( adjustable)

Plugging Hole Pressure

0-6kgf(adjustable)

Noise (normal operation)

≦ 75dB

Paste pressure

Cylinder push force: 0-6kgf (adjustable)

Pneumatic push force: 0-6kgf (Use does not exceed 3kgf)

Plugging holes and plate edge spacing

Hole distance from plate edge ≥ 15mm

Operation Panel

Touchscreen and mobile screen operation

Protection Device

Safety light curtain, emergency stops

Paste adding methods

Automatic cartridge change

Failure rate

≦ 1/400h(Failure time/equipment uptime)

Height of operating table

1000±100mm

Scraper speed

5-200mm/sec(adjustable)

Scraper pressure

0-6kgf(adjustable)


Production Capacity

Capacity is affected by aspect  ratio (panel  thickness, aperture diameter), paste viscosity.One plugging and one ES unit
Two plugging and one ES unit
Capacity per hour15–19 PNL/H28–34 PNL/H


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