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It can be used for surface cleaning, activation, or modification of various substrates prior to printing or bonding
Application Areas
Remove organic contaminants
Clean metal bonding pads
Improve wafer bonding adhesion
Enhance film adhesion
Remove metal oxides
Product Features
The unique chamber design ensures excellent uniformity in processing
The product placement platform is flexibly movable,offering convenient operation
With an extremely small footprint, it is highly efficient,pollution-free, and has low operating costs
The equipment boasts high stability and is easy to maintain
The dust-proof exterior design meets the requirements of a cleanroom environment
Specification
Machine Size | 950(W)*1050(D)*1800(H)mm |
Vacuum chamber dimensions | 530(W)*450(D)*500(H)mm |
Electrode distribution | Non-standard customization |
Power supply wattage | 1KW |
Power supply frequency. | 13.56MHz |
Software control | PLC touch screen |
Loadable gases. | 02,N2,Ar |
