Horizontal Plasma Etching and Cleaning Equipment

It can perform processes such as removal of residue in holes, surface cleaning, roughening, and activation

Introductions

Application Areas

PI Surface Roughening and Cleaning

PCB Desmear and Surface Cleaning

FPC Desmear and Surface Cleaning

Surface Roughening and Cleaning of Electronic Materials

Surface Roughening and Cleaning of COVERLY

Product Features

The process is straightforward, and the treatment procedure is automatically controlled

The product processing time is short, and the efficiency is high

Multiple process gases are utilized

The equipment is simple and convenient to operate, with high stability and ease of maintenance

Dedicated specification machines can be customized according to customer requirements

Specification

Machine Size	1865(W)1810(D)2105(H)mm
Vacuum chamber dimensions	675(W)1455(D)960(H)mm
Effective electrode dimensions.	22"*50"
Electrode distribution.	Thirteen layers.
Output rating	10Kw
Output frequency	40KHz
Power	380VAC/100A/3PH/50Hz
Loadable gas	Four Types of Gases
Chiller
Vacuum Pump

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