产品分类

全盈塞孔树脂 PSM-66 系列

产品说明：

全盈PSM-66系列塞孔树脂为网印塞孔或真空塞孔机塞孔之产品，PSM-66 RIV-01为真空塞孔机专用，PSM-66 SP-01为网印塞孔机专用。适用HDI内层压合塞孔、POFV电镀塞孔、PCB外层塞孔，可满足不同型态电路板、金属基板的应用需求。

产品特点：

具有高TG、低吸水率、导热性能良好等特性

100%的固含量，不含任何溶剂，其热膨胀系数小，可避免硬化过程发生裂缝或分层不良的现象

具有良好研磨性，塞孔研磨后表面平整

树脂油墨与PP或镀铜孔壁结合良好

不含容易引发人体肌肤过敏的有害物质

适用的生产工艺：

HDI内层塞孔工艺：

POFV电镀塞孔工艺：

PCB外层塞孔工艺：

产品性能图示 Performance icon

Functions：

WIN ALL PSM-66 resin ink is used for both silk screen printing plugging and vacuum plugging. PSM-66 RIV-01 is designed for vacuum plugging, and PSM-66 SP-01 is designed for silk screen printing plugging. It fit for plugging on HDI, POFV and PCB. It can meet the requirements for difference types of PCB and metal base panels.

Features：

High TG, low water absorption and good thermal conductivity.
It can avoid any cracks and stratifications during hardening process duo to 100% solid content, solvent free and small coefficient of thermal expansion.
The surface of panel is smooth after grinding because of good abrasiveness of the ink.
Good adhesion for the ink and the wall of the holes
It does not contain harmful substances that can cause allergies.