全盈塞孔树脂 PSM-66 系列

产品说明

   全盈PSM-66系列塞孔树脂为网印塞孔或真空塞孔机塞孔之产品,PSM-66 RIV-01为真空塞孔机专用,PSM-66 SP-01为网印塞孔机专用。适用HDI内层压合塞孔、POFV电镀塞孔、PCB外层塞孔,可满足不同型态电路板、金属基板的应用需求。

           

产品特点:

  • 具有高TG、低吸水率、导热性能良好等特性  
  • 100%的固含量,不含任何溶剂,其热膨胀系数小,可避免硬化过程发生裂缝或分层不良的现象
  • 具有良好研磨性,塞孔研磨后表面平整
  • 树脂油墨与PP或镀铜孔壁结合良好
  • 不含容易引发人体肌肤过敏的有害物质

适用的生产工艺:

HDI内层塞孔工艺

 

 POFV电镀塞孔工艺: 

PCB外层塞孔工艺:  

 

 

产品性能图示  Performance icon

 

 

Functions:

     WIN ALL PSM-66 resin ink is used for both silk screen printing plugging and vacuum plugging. PSM-66 RIV-01 is designed for vacuum plugging, and PSM-66 SP-01 is designed for silk screen printing plugging. It fit for plugging on HDI, POFV and PCB. It can meet the requirements for difference types of PCB and metal base panels.

 

 Features:

  • High TG, low water absorption and good thermal conductivity.
  • It can avoid any cracks and stratifications during hardening process duo to 100% solid content, solvent free and small coefficient of thermal expansion.
  • The surface of panel is smooth after grinding because of good abrasiveness of the ink.
  • Good adhesion for the ink and the wall of the holes
  • It does not contain harmful substances that can cause allergies.

Production process:

 

HDI inner layer plugging hole:

 POFV plating plugging hole:

 PCB Outer Layer Plugging Hole:

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