垂直真空塞孔机 SET-VCP5000P

垂直真空塞孔机 SET-VCP5000P

Vertical Vacuum Plugging Machine SET-VCP5000P

★塞孔行业领航者

可选70:1高纵横比机型

    针对线路板bga超高纵横比、ATE板、IC测试板、载板专门研发

 产品说明:

      利用真空原理实现导电非导电树脂油墨塞孔工艺,适用于整板通孔、单双面盲孔、背钻孔等多种类型的塞孔工艺,适用于树脂油墨银膏、铜桨、导电胶。

 产品特点

      完全解决高纵横比塞孔板中存在的气泡问题。

      塞孔时不需要治具和导气板

      操作面自动化、人性化、易操作 

 

 

产品规格

一刮

两塞

塞一刮

两塞一刮

  尺寸  

 2730*840*2237mm

 4567*840*2237mm

 5000*3200*3780mm

 7500*3200*3780mm

  生产板尺寸  

 660*863mm

 660*863mm

 762*1270mm

 762*1270mm

  生产板厚  

 0.25-7.0mm

 0.25-7.0mm

 0.25-7.5mm

 0.25-7.5mm

  最大纵横比  

 40:1 or 70:1

 40:1 or 70:1

 40:1

 40:1


Function
s:

    This equipment is designed for PCB on whole via hole,blind via and back drilling holes filling with conductive and non-conductive resin ink by vacuum.It is suitable to use resin ink,silver paste, copper slurry,conductive resin.

Features

    Complete solutions for the air bubble defect in high aspect ratio panels.

    Additional tools and air guide plate is not necessary during hole filling.

    Friendly interface, Easy operation, Automation

Specifications:

Model 

SET-VCP5000P-1

SET-VCP5000P

SET-VCP3050-1

SET-VCP3050

   Machine Size 

 2730*840*2237mm

 4567*840*2237mm

 5000*3200*3780mm

 7500*3200*3780mm

  Panel Size 

 660*863mm

 660*863mm

 762*1270mm

 762*1270mm

  Panel Thickness 

 0.25-7.0mm

 0.25-7.0mm

 0.25-7.5mm

 0.25-7.5mm

  Max. Aspect Ratio 

 40:1 or 70:1

 40:1 or 70:1

 40:1

 40:1

 

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