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Descriptions
Self-developed software with AI function.
Can detect leakage and plugging of holes after drilling.
Real-time inspection of the expansion and contraction of the inner laminates.
Based on sub-pixel contour comparison ，network system algorithm, the detection of tiny defects is more accurate.
Transfer speed is 12 metres per minute, up to 800PNL/h on a standard 18*24inch board.
Highly adaptable to electroplated/reversed copper foils with LED multi-angle optical focusing and linear power supply system.
CAM->AOI data analysis conversion time is 3-8 minutes, short AOI data creation time. (Supports Gerber RS274X)
Multiple part numbers can be placed into the software part number lookup processing pool for automatic intelligent identification during online processing.
Adopting various operation modes, such as cluster server/ distributed, it supports the huge computation volume required by advanced algorithms, and has excellent processing and expansion capabilities.
Optional offline re-inspection function for initial screening of
defects, and reserved AI deep learning interface to achieve intelligent VRS.
It has the function of checking the hole of the outer layer panel and the rise and shrinkage of the inner layer board.
Specification
Machine Size | 1880*2448*1500mm |
Minimum line width/spacing | 3.0mil |
Inspection Size | MIN:14”*14”（350*350mm） MAX:25”*25”(650*650mm) |
Detection of dimensional extensions | Extension of the inspection scale to 30 Inches (762mm) in the incoming panel plate transfer direction——[optional] |
Panel thickness | 0.2 ‐4.5mm Min (0.05mm is the thickness of Core material without copper.) |
Image Capture System | 16K High Resolution Line Scan System |
Data formats | GERBER RS ‐ 274X |
Profile conversion time | 3-10 minutes |
Detection of plate surface form |
[Standard]: Inner layer, wiring type including signal layer, power layer, hybrid shield, mesh. [Optional]: Outer layer, signal layer, power layer, hybrid shield,mesh. |
Test Material | FR-4/CEM Bare Copper Etched plate, Electroplated Copper,Secondary Copper, Aluminium Substrate |
Detectable defects | Short Circuit; Open Circuit; Notch; Burr; Pinhole; Residual Copper; Isolation Ring Bump Copper |
Positioning method | Automatic whole panel edge positioning |
Defect review | Approval of inspection stations |
Lighting System | Multi-Angle LED Spotlight Line Sweep Multi-Group System (Lifetime >= 20,000 hours) |
Detection Method | Comparison of ISP techniques, elemental feature learning, and subpixel contour analysis |
Operation Interface | Support for Chinese and English |
Working Environment | 18℃~ 26℃ RH :40% ～ 60%（non-condensable） |
Power Supply | Fuse 32Amp/AC 220V 50Hz Single phase 3-wire Fuse 32Amp |
Production Capacity
Capacity per hour 800 PNL MAX
