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Product presentation
This 3axis controlled grinding machine is compatible with multilayer buildup PCB processes. Suitable for smallbatch production and prototype development, it can also expand the processing capacity of existing production lines, making it an ideal solution for BGA circuit board fabrication.
Powered by a highprecision XYZ 3axis control system, the equipment enables selective and multizone selective processing on designated areas of circuit boards. For rigidflex PCBs, it features a proprietary selectiveskipping function: the brush roller automatically avoids flexible zones while performing controlled grinding on copper surfaces. This improves process quality, reduces brushroller wear, and fully meets the diverse processing requirements of highend PCB manufacturing.
Features
3 axis control, adjustable speed and brush pressure
Adjustable belt conveyor speed
Very high flexibility
Useful for small productions or prototypes
Automatic zero set-point procedure
Selective and skipping planarization mode
Ideal for BGA applications
Technical Data
Machine Size | 1900*2000*1980mm（74.8”*78.7”*77.9") |
Working Width | 780mm(30.7") |
Working Heigth | from 900mm(35.4") |
Max Board Size | W.780mm×L. ∞mm (W.30.7“XL. ∞ ) |
Min Board Size | W.200mmXL.200mm(W.7,87”X7,87") |
| Min thickness | 0.1 mm (0.004"),FR4 Core board+2×35 μm Copper layer |
| Max thickness | 8 mm (0.31") |
Conveyor Speed | 0.3 ~ 3 m/min（0.98 – 9.8 ft/min） |
| Spindles | 1 |
| Water consumption | adjustable according configuration |
Max Installed Power | 2 kw（400/480 V - 3ph - 50/60 Hz） |
Cabinet | integrated |
| Control | HMI touch screen |
